INDIAN ARMED FORCES CHIEFS ON OUR RELENTLESS AND FOCUSED PUBLISHING EFFORTS

The insightful articles, inspiring narrations and analytical perspectives presented by the Editorial Team, establish an alluring connect with the reader. My compliments and best wishes to SP Guide Publications.

— General Upendra Dwivedi, Indian Army Chief

"Over the past 60 years, the growth of SP Guide Publications has mirrored the rising stature of Indian Navy. Its well-researched and informative magazines on Defence and Aerospace sector have served to shape an educated opinion of our military personnel, policy makers and the public alike. I wish SP's Publication team continued success, fair winds and following seas in all future endeavour!"

— Admiral Dinesh Kumar Tripathi, Indian Navy Chief

Since, its inception in 1964, SP Guide Publications has consistently demonstrated commitment to high-quality journalism in the aerospace and defence sectors, earning a well-deserved reputation as Asia's largest media house in this domain. I wish SP Guide Publications continued success in its pursuit of excellence.

— Air Chief Marshal A.P. Singh, Indian Air Force Chief
       

Teledyne FLIR OEM Launches Boson+ IQ Thermal Imaging Development Kit at DSEI UK 2025

New Hardware and Software Development Kit Accelerates Thermal Imaging and AI Integration at the Edge.

Goleta, California September 3, 2025 Photo(s): By Teledyne FLIR

Teledyne FLIR OEM, part of Teledyne Technologies Incorporated and the global leader in thermal imaging innovation, today announced the launch of the Boson®+ IQ Development Kit. The comprehensive solution combines reference hardware with Prism™ software, empowering integrators to rapidly develop edge AI capabilities using advanced thermal sensing across defense, security, and industrial platforms.

At the heart of the kit is the Teledyne FLIR OEM AVP, powered by the Qualcomm® Dragonwing™ QCS8550 system-on-chip (SoC), which delivers an industry-leading 50 trillion operations per second (TOPS) with a typical power draw of just 2.5 watts. Its multicore architecture supports Prism AI object detection models and Prism ISP features, including denoising and super resolution to provide exceptional image clarity in challenging environments.

"The Boson+ IQ Dev Kit represents a major leap forward for integrators building smarter, more efficient thermal systems at the edge with AI particularly for autonomy applications such as aerial drones, loitering munitions, and ground-based robotics," said Jared Faraudo, vice president of product management and programs, Teledyne FLIR OEM. "By combining our high-performance Boson+ thermal camera with Prism AI and ISP software on a cutting-edge Qualcomm compute platform, we're enabling faster development cycles, industry-best image quality, and longer mission endurance with minimal power consumption."

Designed for flexibility and scalability, the kit includes interface and carrier boards with three MIPI interfaces, allowing developers to integrate visible or other sensor types into their systems. It also comes with the Boson+ and Prism SDKs, hardware interface control documentation (ICD), and expert engineering support, providing a seamless development experience from prototype to deployment.

The Boson+ IQ Development Kit is future-ready, with compatibility for upcoming additions, including Prism SKR and Prism Supervisor. Prism SKR facilitates autonomous target detection and terminal guidance, while Prism Supervisor offers autonomous operation to designated way points via GPS or visual-based navigation (VBN) location technology. These software-enabled features can add powerful capabilities to mission-critical applications in defense, security, and industrial automation.